Get your brand in front of the Technology buyers at Wafer Level Packaging Symposium with geofenced ads.
Date
Feb 9, 2027 — Feb 11, 2027
Venue
The Westin San Francisco Airport, San Mateo, CA, USA

About
TechnologyThe Wafer-Level Packaging Symposium is set to take place at The Westin San Francisco Airport in San Mateo, United States. This event will focus on the evolution of advanced packaging technology, particularly in the context of significant changes in system designs that directly influence package performance requirements. Traditionally, circuit architects have had to work within packaging constraints to avoid undesirable outcomes. However, with rising transistor costs and the push for enhanced power efficiency, there is a pressing need to advance packaging technologies beyond conventional limits.The symposium will gather leading experts from the semiconductor industry to discuss various topics related to wafer and panel-level packaging, 3D device packaging, advanced manufacturing, and testing technologies. Attendees will have the opportunity to engage with cutting-edge technological and business trends in the heart of Silicon Valley. The event promises a dynamic technical program featuring presentations on the forefront of semiconductor packaging technologies. Among the highlights will be two professional development courses hosted by SMTA, including sessions such as 'Pioneering System Integration for Tomorrow's AI Workloads' by Ashkan Seyedi from NVIDIA, and 'The CHIPS and Science Act: Past, Present and Future of U.S. Microelectronics R&D' presented by Erik Hadland from the Semiconductor Industry Association. Other notable speakers include Manish Dubey from AMD, who will discuss 'Advanced Packaging: Key Enabler for AI,' and Michael Khbeis from Meta/Facebook Reality Labs Research, who will explore 'Wafer-level Fan Out Technology Options to Realize High-Performance AI Enabled Augmented Reality Wearable Devices.' Additionally, Choon Lee from JCET Group will present insights on the journey to a sustainable digital age through advanced packaging.The Symposium is sponsored by SMTA, an international association dedicated to electronics engineering and manufacturing professionals. SMTA provides exclusive access to a wealth of resources including local, regional, domestic, and global communities of experts, along with research and training materials from thousands of companies committed to advancing the electronics industry. With 55 regional chapters and various technical conferences and vendor exhibitions worldwide, SMTA plays a crucial role in the sharing of knowledge and best practices, making it an exceptional platform for students and young professionals to connect with their field and potential employers.
Industry
Technology
Industry
Technology
Venue
The Westin San Francisco Airport
Location
The Westin San Francisco Airport, San Mateo, CA
San Mateo, CA, USA
Website
smta.org/mpage/waferTopics
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Wafer Level Packaging Symposium in San Mateo concentrates Technology professionals in one place, so your ads reach people already interested in your category instead of a broad, untargeted crowd.
Draw a geofence around The Westin San Francisco Airport in San Mateo and serve display, video, or CTV ads to the phones inside it — the same audience an exhibitor pays for, without the booth, travel, or staff.
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Wafer Level Packaging Symposium draws Technology professionals, a focused audience for well-targeted advertising.
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