InterPACK

The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems, known as InterPACK, stands as the premier global forum dedicated to pioneering research, development, manufacturing, and applications within the fields of electronics packaging and heterogeneous integration. As the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK serves as a critical gathering point for the entire systems ecosystem, encompassing advanced materials, thermal management solutions, next-generation computing architectures, and intelligent, connected devices. The conference's agenda is broad and includes topics such as Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, the Internet of Things (IoT), Additive and Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, as well as Autonomous, Hybrid, and Electric Vehicles.InterPACK's strength lies significantly in its international community, which encourages essential collaboration among industry leaders, academic researchers, national laboratories, funding agencies, start-ups, and entrepreneurs. The conference format includes not only technical paper presentations and exhibits but also offers a rich program featuring panel discussions, workshops, tutorials, and keynote and technology talks delivered by distinguished experts in the field. Additionally, a joint poster session will facilitate interaction and exchange between industry representatives, national laboratories, and academia, creating a dynamic environment for knowledge sharing and innovation. The event will take place at the San Diego Marriott Mission Valley in San Diego, United States, and aims to reach a diverse audience, including attendees from Bangladesh.