International Conference on Physical Assurance and Inspection of Electronics

The International Conference on Physical Assurance and Inspection of Electronics (PAINE) serves as a premier platform for researchers and practitioners from academia, industry, and government to engage in meaningful discussions surrounding advancements in hardware security, physical inspection, and the assurance of electronic supply chains. With the increasing vulnerabilities of electronic devices due to their complex life cycles and diverse applications, physical inspection has gained prominence in recent years. The conference addresses crucial topics including new metrologies for characterization and assurance, advanced packaging, emerging trends in physical inspection, and the integration of artificial intelligence in inspection processes. Furthermore, it delves into countermeasures against tampering, fault injection assessments, and the security of analog and mixed-signal circuits. Key areas of interest span from FPGA vulnerabilities to counterfeit detection techniques, providing a comprehensive overview of current challenges and innovations in the field.The PAINE conference features notable contributions from esteemed speakers, including Jie Zhang, Zhansen Shi, Hanchen Wang, Zhuoyang Zhang, Lucas Lum, Quanhao Gan, Shaoyu Cai, and Eng Tat Khoo from the National University of Singapore, as well as Meghana Jain and Douglas Summerville from Binghamton University. Participants will benefit from networking opportunities with industry leaders and government representatives, fostering collaboration and knowledge sharing. The event also offers a sponsorship program, allowing companies to showcase their instruments and innovations, thereby enhancing their visibility through logo recognition in the conference program booklets and on the official conference website. Sponsorship tiers include Diamond, Platinum, and Gold levels, each providing unique promotional opportunities and benefits. The PAINE conference not only highlights the significant strides in physical assurance and inspection but also emphasizes the need for ongoing dialogue and development in this critical area of electronics security.