International Conference on Physical Assurance and Inspection of Electronics

The International Conference on Physical Assurance and Inspection of Electronics (PAINE) serves as a premier platform that gathers researchers and practitioners from academia, industry, and government sectors to delve into critical advancements in hardware security, physical inspection, and supply chain assurance related to electronics. As the complexity of electronic devices continues to escalate, the need for robust physical assurance methods has become imperative. This conference addresses the growing vulnerability of electronic devices to various threats, and emphasizes the importance of developing relevant solutions to these challenges through informed dialogue.Topics of interest at PAINE span a wide range of areas, including novel metrologies for characterization and assurance, advanced packaging and heterogeneous integration, and the integration of image analysis and artificial intelligence in assurance and inspection processes. Additionally, the conference covers emerging topics in physical inspection, including automated inspection techniques, security primitives involving novel devices and materials, and countermeasures against various vulnerabilities such as trojans, counterfeit detection, and fault injection assessments. Attendees will benefit from the insights shared by esteemed speakers, including Jie Zhang, Zhansen Shi, Hanchen Wang, Zhuoyang Zhang, Lucas Lum, Quanhao Gan, Shaoyu Cai, and Eng Tat Khoo, among others, who represent leading institutions such as the National University of Singapore and Colorado State University. Moreover, PAINE provides substantial opportunities for exhibitors and sponsors, including tiered sponsorship packages. Diamond Sponsors receive prominent recognition with their logos displayed on the conference program booklet and the official website, along with a complimentary showcase table at the workshop. Platinum and Gold Sponsors also gain significant visibility and promotional opportunities, ensuring their contributions are acknowledged throughout the event. This conference not only highlights cutting-edge research but also fosters an environment of collaboration and innovation in the field of physical assurance and inspection of electronics.